- One-bottle, One-coat convenience.
- Proven long-term bond strength.
- Virtually NO post-operative sensitivity.
- 35-second placement time reduces risk of contamination.
- Moisture tolerant - works on wet or dry enamel and dentin.
- Uniquely suited for the "selective" etch technique.
- Low microleakage.
- Refrigeration not required (if used within 6 months).
Indications
Direct Placement Indications
- Bonding light-cured composite or compomer for all classes of direct restorations.
- Root surface desensitization.
- Sealing of dentin prior to amalgam restorations.
- Protective varnish for glass ionomer restorative materials.
- Repair of composite or compomer restorations.
- Bonding sealants.
Indirect Placement Indications
- Bonding veneers with RelyX™ Veneer Cement.
- Adhesive/primer for chemical adhesion when bonding zirconia, alumina, metal or glass ceramic restorations.
- Intraoral repair of existing indirect restorations.
- Bonding self- or dual-cure core build-up materials and resin cements (with Scotchbond™ Universal DCA Dual Cure Activator).
- Sealing of dentin prior to temporization for indirect restoration placement.
Light-curing Single Bond Universal is ideal for a wide range of indications:
- Bonding light cured composite - total etch on cut enamel.
- Bonding light cured composite - total etch on uncut enamel.
- Bonding light cured composite - self etch.
- Bonding light cured composite - selective etch.
- Root surface desensitization.
- Sealing of dentin prior to amalgam restorations.
- Protective varnish for GI restorations.
- Repair of composite restorations.
- Bonding pit and fissure sealants in both total etch and self etch mode.
- Bonding veneers with a conventional resin cement.
- Bonding high strength substrates like zirconia, alumina and metal.
- Bonding weak ceramics like glass ceramics.
- Intraoral repair of indirect restorations.
- Bonding self- or dual- cure material and resin cement with dual cure.
- Activator (example: single bond universal dual cure activator).
- Sealing dentinal tubules prior to temporization in self etch mode